• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention relates to an electronic assembly with a housing, a plurality of cooling fins being provided on the outside of the housing, which run in different directions, the total of cooling fins being divided into two groups (2, 3), the cooling fins within one group (2, 3) are parallel to one another, but form an angle (a) with the cooling fins of the second group (2) which is between 45 degrees and 135 degrees, preferably between 75 degrees and 115 degrees, and the two groups (2, 3 ) are separated from each other by cooling fins by an area (4) free of cooling fins, the area (4) free of cooling fins extending along an axis of symmetry (S) of the entirety of the cooling fins and its width steadily reducing along the axis of symmetry (S).
    公开号:AT17049U1
    申请号:TGM98/2018U
    申请日:2018-05-02
    公开日:2021-04-15
    发明作者:
    申请人:Zumtobel Lighting Gmbh；
    IPC主号:
    专利说明:

    description
    ELECTRONIC ASSEMBLY WITH A HOUSING WITH COOLING FINS
    The invention relates to an electronic assembly comprising a housing, wherein a plurality of cooling fins are provided on the outside of the housing in order to dissipate the heat generated by the electronic components of the assembly.
    Arrangements and geometries of cooling fins to protect electronic components from overheating, there are already many in the prior art. Often, however, the arrangement of the cooling fins is characterized by the economy of the manufacturing process. In the case of essentially rectangular housings, for example, cooling fins are usually formed along either a longitudinal extent or a transverse direction of the housing. However, this has the disadvantage that with common orientations of the entire assembly (longitudinal direction vertical or horizontal) the cooling fins run either vertically or horizontally. This has a significant influence on the actual cooling performance, because convection, which takes place for the exchange of air along the cooling surfaces of the cooling fins. In particular, the extension in the longitudinal direction is problematic. On the one hand, the exchange of air is relatively poor with a horizontal orientation of the cooling fins. On the other hand, when the assembly is installed in such a way that the cooling fins run in a vertical direction, the air required for cooling is heated along the extension of the cooling fins to such an extent that a cooling effect can hardly be detected at the upper end. There is therefore a considerable temperature gradient within the electronic assembly, which can lead, for example, to premature failure of components which are arranged at the hot end of the housing or which requires this fact to be taken into account in the circuit board design.
    Arrangements of cooling fins that are not parallel to an outer edge of the housing have also been proposed. These then run both with a vertical and with a horizontal orientation of the longitudinal extent of the electronic assembly with a vertical portion which enables a flow through the channels formed between the cooling fins. It is already known from WO 2015/186016 A1 to extend the cooling ribs in four groups, starting from a center point of an outside of a lamp housing, approximately to the outer corners of the lamp housing. This ensures that flow paths are available that allow the lamp to be cooled, both with a vertical and with a horizontal orientation or mounting of the lamp. The efficiency of the cooling in such an arrangement is limited, however. In particular, a difficult supply of fresh air for cooling is sometimes possible, as a result of which the total cooling output is less than ideally possible. Due to the division into four groups, only cooling fins of two groups are advantageously positioned. The other cooling fins are more of a hindrance to the air flow in that they lead the air into a central area, where there is a stagnation of air which clearly hinders the outflow of the heated air.
    The invention is therefore based on the object of proposing an electronic assembly with cooling fins arranged on a housing for passive cooling, which allows improved cooling in several preferred mounting positions of the electronic assembly. The object is achieved by the electronic assembly having the features of claim 1.
    In the electronic assembly according to the invention, a plurality of cooling fins are provided on an outside of a housing in which the electronic and heat-generating elements are arranged. These cooling fins run in different directions, so they form an angle with one another. The totality of the cooling fins formed on the housing is divided into two groups. The cooling fins within each group are arranged parallel to one another. The cooling fins of the first and the second group enclose an angle with one another which is between 45 degrees and 135 degrees, preferably between 75 degrees and 115 degrees. The two groups of cooling fins are separated from one another by an area free of cooling fins. This means that although the ribs themselves form a V-shaped arrangement, the cooling ribs on the opposite side do not connect.
    have connection to each other. As mentioned, an area free of cooling ribs is provided in this area. The area free of cooling fins extends along an axis of symmetry of the entirety of cooling fins. The width of the area free of cooling fins is steadily reducing along the axis of symmetry.
    The inventive design of an entire cooling surface on a housing of an electronic assembly has the advantage that in a preferred mounting position in which the axis of symmetry extends in the vertical direction, the cooling rib-free area is wider at the lower end than at its upper end. A relatively large amount of air thus enters the channel formed in this way in the lower area, which air is then successively discharged to the outside via the channels formed between the individual cooling fins. The channel, which is becoming narrower and formed by the area free of cooling ribs, thus compensates for the lower air mass that has to flow upwards along the axis of symmetry in order to enter the channels between the individual cooling ribs on both sides of the channel. The passive cooling is thus improved.
    It is true that the cooling fin arrangement is optimized for the installation position described, in which the axis of symmetry is oriented along a vertical direction. However, this arrangement of the cooling fins in two groups with an intermediate channel in particular allows good cooling even in the case of a transverse installation, in which the axis of symmetry runs horizontally. This is achieved because between the cooling fins of the first group and the second group this area free of cooling fins is formed so that the flow that emerges from the channels between the cooling fins of the assembly through which the flow initially flows from below can be easily deflected in order to enter the Channels of the second, upper group to enter. The total length of the channels of both groups, which are open on one side and which are formed between the cooling fins, is still short enough to enable efficient cooling even before exiting the channels on the upper side of the mounted electronic assembly.
    In contrast to the prior art, it is avoided that the cooling fins formed on an electronic component only fulfill their function in a certain installation position or that a bad compromise has to be accepted for all assembly orientations. The division into two groups of cooling fins, the two groups being designed symmetrically to an axis of symmetry, allows uniform cooling over the entire cooling surface and optimizes the flow of the cooling air, especially for the preferred installation position.
    According to a preferred embodiment, the axis of symmetry extends along the longest version of the electronic assembly. This has the advantage that the cooling ribs running obliquely to the axis of symmetry and thus the channels formed between them do not become too long and excessive heating of the cooling air flowing along is avoided.
    According to a further preferred embodiment, the two groups of cooling fins are formed on a substantially rectangular cooling surface, the length of which is 1.5 to 5 times, preferably 2 to 4 times, particularly preferably slightly 2.75 to 3 times , 25 times its width. In the case of the specified dimensions, the design with the tapering area free from cooling ribs arranged between the two groups has proven to be particularly advantageous. The lengths of the channels between the cooling fins are then such that particularly uniform cooling of the entire surface is possible. Above all, this also simplifies the layout of the electronic circuits to be cooled, since adequate cooling is ensured regardless of the respective installation position of the individual electronic components. This increases the degree of freedom in the design of circuits.
    In order to optimize the flow, especially in the preferred installation position, it is particularly advantageous to adjust the width of the cooling rib-free surface from 10 percent to 30 percent of the width of the cooling surface, preferably evenly over its entire length to 5 percent to 15 percent of the width of the cooling surface to reduce, preferably from 15 percent to 25 percent to 7.5 percent to 12.5 percent. These conditions have proven to be particularly advantageous in order to still have sufficient flow along the coolant-free surface at the wide end of the coolant-free surface
    To enable channels formed between the cooling fins, so that a rapid discharge of the cooling air by means of convection is possible. Along the area free from cooling fins that is becoming narrower, the channels between the cooling fins in the two groups then become somewhat longer, but without already reaching a total length at which the cooling air has already been excessively heated at the respective outlet end of the cooling air channels.
    The electronic assembly according to the invention is particularly preferably an operating device for lighting means. Such operating devices for lamps are usually mounted externally and usually mounted in one of two preferred mounting positions. With the arrangement according to the invention, especially for elements that are preferably mounted in two different directions, it is still ensured that the entire assembly is adequately cooled.
    A preferred exemplary embodiment of the electronic assembly according to the invention is shown in FIG. 1 and is explained below with regard to its details. It shows:
    Figure 1 is a perspective view of an electronic assembly according to the invention with cooling fins provided on the housing.
    FIG. 1 shows part of a housing of an electronic assembly. Such a housing part 1 is preferably manufactured as a metal injection-molded part and is provided for receiving, for example, an assembled printed circuit board which can also be encapsulated in the housing part 1. In the exemplary embodiment shown, the housing component 1 is essentially cuboid, with one side, which cannot be seen in FIG. 1, being open for equipping and, if necessary, subsequent potting. A first group 2 of cooling fins and a second group 3 of cooling fins are provided on the illustrated housing part 1. The two groups 2, 3 of cooling fins lie symmetrically to a line of symmetry S, which extends along the longest extension of the housing part 1. An area 4 free of cooling fins is formed between the first group 2 of cooling fins and the second group 3 of cooling fins. Together with the area required by the first group 2 and the second group 3, the area 4 free of cooling ribs forms a rectangular cooling area with a width B and a length L. In the exemplary embodiment shown, this takes up a large part of the entire outer surface of the housing part 1 shown. The individual cooling fins of the first group 2 and the second group 3 are positioned in such a way that an imaginary extension of a cooling fin of the first group 2 would intersect exactly on the axis of symmetry S with an imaginary extension of a cooling fin of group 3. For transverse mounting, this has the advantage that the cooling air exiting between the cooling fins of the second group 3, for example, can enter the opposite area between the corresponding cooling fins of the first group 2 after crossing the cooling fin-free area 4 without further deflection. The flow losses are thus kept small and efficient cooling is achieved.
    The angle at which the cooling fins of the first group 2 and the second group 3 are to each other is preferably between 45 ° and 135 °, angles between 75 ° and 115 ° are preferred and it has been shown that here a particularly uniform and effective cooling can be achieved. The adaptation of the angle between the cooling fins is mainly dependent on the resulting length of the channels between the cooling fins of the first group 2 and the second group 3. It should be noted that the cooling fins of the first group 2 and the cooling fins of the second group 3 are, as already mentioned, arranged symmetrically to the axis of symmetry S, that is to say in particular also enclose an identical angle with it. The ratio of length L to width B of the rectangular cooling surface is between 1.5 and 5, preferably between 2 and 4, particularly preferably between 2.75 and 3.5. In particular, with the latter ratio of length L and width B, area ratios result for the total area occupied by the first group 2 or the second group 3, which enables the formation of a length of the cooling channels guiding the flow between the individual cooling fins, which enables the overflow of the the cooling rib-free surface 4, which forms a channel, so to speak, is made possible. The surface free of cooling ribs has a first width d at one end; and tapers to a second width d »at its other end. The so
    The resulting surface 4 free of cooling ribs is trapezoidal overall and is also symmetrical to the line of symmetry S. The larger first width d +; is preferably 10% to 30% of the width B of the entire cooling surface, preferably between 15% and 25%. At the narrower second end, however, the second width d »is between 5% and 15% of the width B of the cooling surface, preferably between 7.5% and 12.5%. The constant tapering of the area 4 free of cooling ribs enables a relatively large air mass to easily enter when the electronic assembly is oriented in its preferred assembly direction in which the axis of symmetry S extends in the vertical direction. The area 4 free of cooling ribs, which becomes narrower, takes into account the outflow of cooling air through the channels formed between the ribs of the first group 2 and the ribs of the second group 3. The narrowing also has the effect that the flow velocity is approximately maintained, so that a uniform heat transfer between the surface of the housing part 1 and the cooling air is possible. This also contributes to more uniform overall cooling of the electronic assembly.
    In particular, the specified widths at the wide first end d + and the narrow second end d> »of the cooling rib-free area 4 have proven to be positive with regard to the air distribution to the cooling rib spaces with the specified length and width ratios of the housing part 1. On the one hand, the channel created between the first group 2 and the second group 3 is sufficiently large to ensure a reliable supply of incoming cooling air. On the other hand, the area 4 free of cooling ribs remains narrow enough to reliably avoid an increase in the temperature in this area, in which there is no surface enlargement due to the cooling ribs. At the same time, the total length of the cooling channels formed between the cooling fins of the first group and the cooling fins of the second group is so long or short that here, too, there is practically no temperature increase at the end of the channels. This applies even if, as already described, the axis of symmetry S extends in the horizontal direction. It can be seen that a widening, i.e. an increase in the width B of the housing part 1, for example, by an increasing angle a between the cooling fins of the first group 2 and the cooling fins of the second group 3 can be partially compensated for the width B in relation to the length L can be adjusted to smaller angles.
    权利要求:
    Claims (5)
    [1]
    1. Electronic assembly with a housing, a plurality of cooling fins are provided on the outside of the housing, which run in different directions, characterized in that the totality of cooling fins is divided into two groups (2, 3), the cooling fins within a group (2, 3) are parallel to one another, but form an angle (a) with the cooling fins of the second group (2) which is between 45 degrees and 135 degrees, preferably between 75 degrees and 115 degrees, and the two groups (2, 3 ) are separated from each other by cooling fins by an area (4) free of cooling fins. The area (4) free of cooling fins extends along an axis of symmetry (S) of the entirety of the cooling fins and its width is steadily reduced along the axis of symmetry (S).
    [2]
    2. Electronic assembly according to claim 1, characterized in that the axis of symmetry (S) extends along the longest dimension of the electronic assembly.
    [3]
    3. Electronic assembly according to claim 1 or 2, characterized in that the two groups (2, 3) of cooling fins are formed on a substantially rectangular cooling surface, the length (L) of which is 1.5 times to 5 times, preferably 2 to 4 times, particularly preferably about 2.75 to 3.25 times their width (B).
    [4]
    4. Electronic assembly according to claim 3, characterized in that the width of the cooling rib-free surface is reduced from 10% to 30% of the width of the cooling surface to 5% to 15% of the width (B) of the cooling surface, preferably from 15% to 25% to 7.5% to 12.5%.
    [5]
    5. Electronic assembly according to one of claims 1 to 4, characterized in that the electronic assembly is an operating device for lighting means.
    1 sheet of drawings
    类似技术:
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    同族专利:
    公开号 | 公开日
    EP3541157A1|2019-09-18|
    EP3541157B1|2021-07-28|
    DE202018101375U1|2018-06-14|
    CN210226030U|2020-03-31|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    WO2010121428A1|2009-04-23|2010-10-28|Sapa Profiles Holding Ab|Method of manufacturing heatsink with angled fins|
    JP2011114102A|2009-11-26|2011-06-09|Furukawa-Sky Aluminum Corp|Heat sink|
    US20170241721A1|2016-02-19|2017-08-24|Enzotechnology Corp.|Heat sink with designed thermal conudctor arrangement|
    ES2535385T3|2009-10-22|2015-05-11|Thermal Solution Resources, Llc|Overmolded LED lighting assembly and manufacturing method|
    DE102014106570B4|2014-05-09|2016-03-31|Semikron Elektronik Gmbh & Co. Kg|Power semiconductor module with switching device and arrangement hereby|
    WO2015186016A1|2014-06-03|2015-12-10|Koninklijke Philips N.V.|Luminaire heat sink|CN210725817U|2019-09-04|2020-06-09|中兴通讯股份有限公司|Composite tooth radiator and communication base station|
    CN111525820B|2020-06-09|2021-02-05|重庆宗申电子科技有限公司|Inverter and assembly process thereof|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    DE202018101375.0U|DE202018101375U1|2018-03-12|2018-03-12|Electronic assembly with a housing with cooling fins|
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